Engineer Support Sr.
Qualcomm Inc
Total des années d'expérience :19 years, 10 Mois
Skills:
•Strong Work Ethics, Efficiency and Interpersonal skills
•Effective time management and coordinating skills
•Ability to be decisive and effective under pressure
•Ability to observe, analyze and interpret information
•Exceptional written and oral communication skills
•Communication skills in interpreting and detailing technical specifications effectively
•Teamwork skill to work and coordinate with team mates in producing desired results
•Ability to drive Projects given for any HW bring-up and debug Support with End-End Funtional Testing with Team
•Strong understanding & Reading of Circuit Schematic/Layout for Multi layer Boards.
•Expertise in Debugging the Hardware and Fault Tolarance & Analysis.
•Excellent understanding of Digital Electronics and Designing.
•Power Optimization and consumptions Measurement using Spartan Station and Xerxes system and anlyze the blocks which are consuming much current and Debug.
•Characterization of Thermal Profiling of MSM Parts and analysing of Thermal Errors from Dash Board
•Strong Understanding for the Power Grid and debug the HW with root cause analysis
•SIM Programming using Gemalto Card Admin and support provided for CSIM, RUIM & USIM and Tool License Management
•Hands on experience and strong understanding on how to load any Software build in any of the Qualcomm Hardware.
•New Hardware Bring-up, testing, analyze & Debug and deliver to end user with a presentation on how to use the HW in terms of SW Load and heads-up of the hw archietecture blocks.
•Using Xilinx FPGA debugger can programm the Blocks (Banks) in the Hardware for Digital Communication and upgradation of the new firmware
•Can Play with Oscilloscope, Logic Analyzer, 8960-Agilent Test Euipment, Spectrum Analyzers, Anritsu Call Box.
•Calibration of Harware using 8960, Anritsu Call Box and collect the Logs for debugging and analysing and Debugging of RF Path.
•Usage of Lauterbach Debugger with Trace 32 Software using ARM7, ARM9, ARM11, Cortex Dongles, Q6, SWD, Krait & Sparrow.
•Hands-on Expertise in BGA Rework Systems like Finetech and Weller with explosure for Profiling of the any BGA’s (MSM, MDM and other BGA Memories etc)
•Soldering Expertise Techniques for POP Parts Stacking, Flip chip Bonding etc.
•Team synchronization with knowledge sharing, Leading and People Management and good in decision making
•Strong knowledge on Spartan/Xerxes/Kratos systems and XPM/RCM/MTP HW and its Power Grids
•Process oriented for any new project Bring-up, knowledge transfer and FAQ documentation during the activities
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