ساراث vijayan

Hardware Electronics System Development/ Testing:
• Led the team of hardware, software, mechanical and layout engineers for development of an electronic glass that allow vision to legally blind people.
• Created FRS (functional requirement specs) and detailed design specs based on the customer’s requirement document and assigned task to other engineers for the completion of the design.
• Designed the Snapdragon 820 based main electronics board that interface with camera, display interface and batteries.
• Board includes signals of different digital protocol namely MIPI CSI, DSI, HDMI, UART, I2C, SPI, PCIE, GPIOs, USB HS, etc and dual battery charging circuits.
• Designed for medium to high volume manufacturability and designed automatic test fixtures for the designs
Technical Management:
• Led technical discussions with customer for whom the hardware for electronic glass was designed
• Prepared functional requirement specs and ATP for the customer
• Software, thermal and mechanical interface management
• Managing outside vendors for PCB manufacturing and component assembly
Innovations, Achievements and Initiatives:
• Designed the hardware which had very tight space constraint and tested it and made the board production ready in 3 months
• Designed and tested an in-house pressure sensor to replace a purchased part and thereby reducing the cost of production by 50% for a product

Hardware Electronics System Development/ Testing:
• Power system and grounding design for the radar payload.
• EMC simulation and modelling using Pspice for high power/frequency satellite payload electronics
• Design and testing of RF amplifier and PLLs for the radar payload.
• Designed and tested a 18 layer mixed signal board for highspeed digital and RF signals (up to 9.6Ghz)
• Harness design and routing using SolidWorks
• Power circuitry design and testing for payload electronics.
• System level integration and testing of satellite payload electronics
Technical Management:
• Led technical discussions with satellite BUS provider regarding the power system integration of payload and satellite BUS
• Mentored junior hardware engineers and kept track of their weekly tasks
• Prepare technical specification for outsourcing the manufacturing of satellite harness, evaluating vendor’s technical capability and make recommendations for awards.
• Managing outside vendors for PCB manufacturing and component assembly
• Drive Engineering Change Proposals and Engineering Improvement Proposals (ECP, EIP)
Innovations, Achievements and Initiatives:
• Designed an innovative grounding scheme for satellite radar payload to avoid ground loops, stray magnetic moments and reducing the power system harness mass by 40%.

Hardware Electronics System Development/ Testing:
• Requirements and proposal definition, design, prototyping, schematics, layout, bring-up, testing and delivery of Analog/Digital/Power electronics modules for the satellite - Full Life Cycle Experience.
• Design, development, testing and research on mission critical, high performance and high reliable Digital 3-axis rate sensor, digital accelerometer, digital MEMS magnetic sensor, analog interface electronics, power distribution modules, etc. for Singapore’s first Satellite. The designs were complex mixed signal boards with Power, analog and digital interface circuits.
• System level integration and testing of satellite sensors and in-house developed electronics
• Design and development of test system and co-ordination of vibration, thermal vacuum and EMI/EMC testing of satellite. (System deployed successfully for 2 successful test campaigns at Intespace, Toulouse, France).
Technical Management:
• Software hardware integration management, Test process management, Mechanical / Thermal / CAD team deliverables management, and PCB manufacturing and assembly co-ordination.
• Manage testing and delivery process by creating test strategy, scenarios, test specification, pass criteria, configuration control, regression testing and test results review
• Provide technical guidance for development of software drivers, BSP, test driver harness, test benches, test infrastructure to complete testing and delivery.
• Sign off and hand over to System engineering, sub-system teams and customers after satisfying acceptance review.
• Lead meetings with mechanical engineering, thermal, harnessing and CAD team engineers to drive finalization of component arrangement, design for signal integrity, chassis design, mass distribution / design for structural integrity, thermal heat dissipation.
• Drive Engineering Change Proposals and Engineering Improvement Proposals (ECP, EIP)
Innovations, Achievements and Initiatives:
• Initiated and successfully led a project for in-house development and qualification of satellite rate sensor and magnetic field sensor thus replacing the expensive procured sensors from satellite resulting in 80% cost saving.
• 14 major, mission critical hardware designs delivered with full test results to customer.
• Extensive research, radiation test system design and selection of an alternative switch mode power regulator chip resulted in 90% cost savings to the mission in a particular component purchase.
• Modular, generic and re-usable hardware design of an analog electronic interface board resulted in reducing design and re-fabrication cost by 80%.
• Qualified a commercial microcontroller for use in space with full latch-up protection circuits.