Mohd Nuruddin Mohd Zairi

Senior Die Attach Process Engineer at Texas Instrument Kuala Lumpur

• Malaysia
• My current job since September 2007

• Responsible in achieving yield goal for die attach process.
• Responsible in optimizing peripherals set up to device.
• Team leader for die attach process FMEA.
• Responsible in validating build of material before die attach process.
• Subject material expert for die attach piece parts designs (collet, dispenser, ejector pin)
• Responsible in qualifying new material prior to usage in production line.
• Support in cost saving initiatives.
• Responsible in improving process in the production line.
• Support in system improvement projects.
• Actively involved in responding to customer complaints related to die attach process.

Senior Process Engineer at Texas Instruments

• Malaysia
• My current job since January 2008

Achieve yield goal for targeted process.
Optimize peripherals to build product
Team leader for process FMEA.
Validate build of material before production process.
Subject material expert for process piece parts designs

at LEADERSHIP ROLES

• January 2016 to

Designed a changeable collet.
(Patent Pending)
Designed method to prepare
samples for research.
Director for Language Camp
Program.
Helped company to prepare
for ISO certification.
* Participated in Conserve Energy Reduce Waste (CREW) Campaign
* Participated in Safety Slogan Competition
* Team Leader for process yield improvement
* Completed Design FMEA for die attach piece parts

• January 2015 to

Completed major substrate change for Quad Fed No-Lead
package
Eliminated critical die attach
reject for the substrate.
2014 Standardization of piece part (collet) for production line Improve process yield
2013 Standardization of piece part (shank) for production line Improve process yield

• January 2015 to

Journey Towards Dimple to NonDimple Leadframe Conversion. Reduce generation of
rejects
2014 Improve Conversion Through Dual Poker Pin. Reduce setup time
2013
Statistical Die Shear Monitoring Method Epoxy performance
monitoring method
2012
Journey of Shank for Rubber Pick Up Tip on ESEC 2008 Improve High Aspect Ratio
collet performance
2011
Expanding Rubber Pick Up Tip To Abacus Die bonder Through
New Shank Design.
Increase legacy platform
capability

• January 2012 to

Design new rubber collet that can be adjustable to fit various
sizes
Sent for patent disclosure

• January 2011 to

New shank design to allow legacy platform to run rubber collet Increase legacy platform
capability

• January 2010 to

Eliminate Damage Metal for BQ29330DBTR. Eliminated damage
metallization on die surface
2009
Reduction of Epoxy Under Mount Pad. Reduce generation of epoxy
under mount pad

• January 2009 to

Completed a new system in die attach to improve material
validation.
Improve production
transaction and tracking