New Product Development Manager, Sr. Principal Product Development Engineer
FAIRCHILD SEMICONDUCTOR, ON SEMICONDUCTOR
Total years of experience :20 years, 8 Months
New Product Development Sr. Manager, FAIRCHILD SEMICONDUCTOR (Suzhou, China & Cebu Philippines, April 2006 -September 2016)
Sr. Principal Product Development Engineer, ON SEMICONDUCTOR (Cebu, Philippines, September 2016 -April 2021)
- Reported to the Business unit Development Engineering Director, as a member of the Staff leadership team of Automotive Product Line organization with new product development engineering, people and project management functions.
- Lead a group of cross functional engineers and technician. Project management.
- Project management and New Products Development. Developed, qualified and released New Products for Automotive business application via APQP, AEC Q101/Q100 standards. Development, qualification and release to production of Discrete and semi-functional new products in standard discrete and smart power module packages intended for Automotive and Industrial applications.
- Product electrical characterization, datasheet generation, test and hardware development qualification, product documentations and PPAP.
- Product sustaining and customer support. Product portfolio management, yield improvement, test time and cost reduction. Test flow and coverage standardization.
- Manage engineering build request, provided technical expertise on yield/parametric data analysis and disposition. Directly involve in defining new product development processes.
- Interface globally with cross functional teams of product line marketing, package development, design, FAE, Quality and Manufacturing Assembly/Test organization whenever necessary to address new product development concerns, customer support needed and to resolve product issues with the customer.
Accomplishments:
- Completed the new product development and release to production of the Known Good Device for Automotive application. This is ON’s first awarded KGD program (Design Win) in a strategic region (Japan) and customer with a business opportunity of US$5M annual revenue, 45% gross margin.
- Successfully developed, qualified and released New Products for Automotive business application via APQP, AEC Q101/Q100 standards with PPAP. Directly responsible and involved in the development of more than 200 Discrete and semi-functional new products in standard discrete and smart power module packages intended for Automotive applications. Examples are the following products with their corresponding potential 5 years total revenue: Fairchild’s first Known good die devices (> $2M), Fairchild’s first Smart Ignition IGBT ($3.5M), Fairchild’s first Smart Power Module products (> $50M). These projects are vital in the successful growth of Fairchild’s automotive business which had attained a 116% growth in revenue and 60% improvement in gross margin within 5 yrs.
- Contributed in the success of the company’s cost reduction initiatives via in-sourcing or cross qualifications of automotive products from one assembly/FAB site to another by managing the completion of more than 200 products electrical characterization, data analysis and disposition process.
- Promoted to Product Development Sr. Manager (May 2012).
- Promoted to Staff Product Engineer (March 2010).
- Handled ON Semiconductor Standard Analog and Logic products at Final Test and wafer sort. Conducted engineering verification, analysis, provided containment/corrective actions and disposition on low yield lots, electrical gate failures, and customer returned product.
- Worked with business unit Product engineers on new product introduction. Completed product test characterization with analysis of results.
- Interface with wafer FAB, onshore product engineers and Assembly/Final Test sites regarding any device/product related issues.
- Generated and implemented several specifications and work instructions for wafer sort/final test. Generated, debug and qualified final test/wafer sort programs.
- Yield enhancement, test time and scrap/cost reduction projects. Directly responsible for the automation of several manual test processes, test program optimization, test method enhancement, guard band and limits optimizations.
- Device Control Map Generation and qualification at wafer sort.
- Lead and worked with a cross functional teams of engineers in investigating and resolving quality issues with customer via 8D methodology.
- Mentored line operators, technicians and apprentice engineers.
Accomplishments:
- OSPI Employee of the Year nominee in year 2005.
- Transferred and qualified the wafer sort process from Europe to the ON Semiconductor manufacturing facility in the Philippines. Successfully set up and sustained the wafer sort process in OSPI.
- Two times Employee of the Month Award with OSPI (Nov.2001 and Dec.2003)
- Provided engineered solutions to wafer sort/final test problems