Field Service Engineer IV
Tokyo Electron
Total years of experience :10 years, 1 Months
Ongoing working on maintain/ modify or install pre/post warranty equipment/tools, following factory procedures and technical manuals.
Working on resolving long-term equipment performance and reliability issues at very dangerous woke environment that surrounded with, reactive gases, toxic gases, wet etch chemical, like HF and HCL, etc., Overhead Vehicles to transport wafers, high voltage and RF.
Collecting/adjust/ verify /compare parameters and identify root cause of alarm system in the equipment.
Participating in field engineer training on current and new product technology.
Completed extensive 3 weeks training of installing /operating Dry etch system equipment with all cables, valves, pumps, RF generator etc.
Fully certified and completed respirator training by EHS and all other PPE related to working in dangerous gas exposure zones.
Fully certify to perform work in high area that requires fall protection procedures in accordance with OSHA guidelines.
Performed safety procedure to Log-out Tag-out of tool before conducting any PM’s or troubleshooting on the equipment.
Followed company manuals procedures and customers safety protocols that align and approved by OSHA and EHS to conduct any activity.
Worked on probe card manufacturing operations from A-Z, that’s included but not limited to: photolithography (laser writer ) on thin film, Dry/wet etches, and plating (gold, copper and rhodium)
Inspect product, check functionality and coating level.
Coached and trained technicians so they get certified to independently operate equipment and tools using BKM.
Periodically conducted conferences with engineers to discuss recommendations that should be considered in order to meet business/customers needs and safety precautions.
Managed to be recognized as the only team member who never had any misprocess and who has one of the highest accuracy and productivity level within my group.
Solely conducted complex semiconductor manufacturing, testing and assembly process (some are over 250 steps process) from the beginning to the end which included single, double and triple metal layers (gold, etc.).
Prevented multiple hazards incidents and misprocess by other team members.
Preformed schematic inspection, and design verification, also was responsible to, perform set-up, calibration.
Interfacing with R&D, Engineering, Production, and Quality Assurance team, to rapidly develop specifications, requirements for metrology equipment and future test methodologies.
Had in depth knowledge of safety for environmental impact of using chemical or preform procedure to avoid hazards and obstacles.
Worked on identifying and preventing potential work hazards from happening to create safe work environment.
Conducted Plasma-etch process for wafers, substrates resist coating, sputter(Aluminum, Gold, Copper Rhodium & Nickle
A. Hardware /Software/QC/Validation and testing engineering tech for circuit boards and platforms.
Supported engineering activities such as testing, installing, configuring and support Factory software / hardware performance & power analysis for android platforms by troubleshooting, debugging system problems and collect data.
Obtained Intel’s appreciation gifts as a result of cooperation and offering technical assistance to other teams.
Preformed Validation testing on FFD (form factor design), RVP (reference validation platform) for windows and android devices by assemble and build android RVP boards and install OS and all the drivers.
Utilized internal software tools (SoC-watch, MPM (Monitor Power Management) VTune, etc.) along with using basic UNIX environments (shell commands) to test, deliver data and analysis for system behavior during preforming workloads KPI’s (Key Performance Indicators) on atom (tablets) or core-based platforms (laptops).
Conducted OS flashing, and updated bios with latest OS via Dedi-prog to install windows firmware along with all necessary drivers, also used PFT tools to flash and install latest OS on Android devices.
Used Allegro tools to debug circuit-board components by identify shorted traces and verify rework schematics.
Configured (Power Automation & Control System) and NI-DAQ (National instrument data acquisition) tools to collect power outputs. Collected power outputs for CPU, GPU, memory, panels, sensors hubs, Wi-Fi, cameras PIMC power data.
Worked on systems debug / troubleshooting for multiple Intel based platforms and silicon’s validation.
Created power point reports, presented test result to application engineers to optimize android APP’s in order to improve performance.
Worked with third-party debugging team on apps to identify crash and scripting error then addressed them to application engineers.
B. Platforms’ manufacturing engineering and testing technology tech (Intel Corp.).
Tested new generation manufactured silicon & SoC’s (System on chips), worked on SMT equipment (Surface-Mount Technology) to assemble and components on the circuit boards substrate, along with loading and unloading (handling) boards into testing equipment tools.
As a result of my successful role and motivation, I was one of the few staff members who were selected by management to be trained and certified to solely operating multi-million dollars equipment’s.
Obtained CPTD certificate of accomplishment for leadership and process improvement from upper management.
Worked on BGA (ball grid array) testing for voids, shorts, misplaced or detecting wrong polarity components on the circuit boards using X-ray technology testing and flying probes, etc.
Worked on Mechanical Assembly Testing (MAT) with MCG (Mobile and communication group) by performed phones and boards assembly install OS and debugging issues.
Tested and troubleshot assembled boards or phone through System Level Testing Line (SLT) which involved Audio testing, Android operating system (AOS) upload and download, Wi-Fi, Camera, NFC and GPS testing ) for new developed phones, tablets or notebooks
Trained and mentor my team on AXI (automated X-ray), Phoenix X-ray, Flying Probe (FP) using Automated Testing Equipment (ATE), along with performed visual Final inspection in compliance with Intel’s corp. and circuit boards IPC’s procedures to validate functionality of new developed motherboards, phones, tablet, servers and other Intel’s based products.
Debugged circuit boards using allegro schematic to trace board's components to verify correct polarity and locate shorts or opens.
Study status in progress to earn the degree.